TECHNOLOGIES
HDI Flexible Circuits
- CAD/Cam DFM engineering
- Laser Direct Imaging
- Sub 25-Micron line and Spaces
- UV &Co2 Laser Drilling/Machining
- Advanced Material Processing
- Custom and RoHS Surface Finishes
- Plasma/Co2 Dielectric Removal
- Vacuum Assisted Lamination
- Precision CNC Machining/ CNC Punching
- Thin Film EMI Sheilding
- High Speed RF Microstrips and Striplines
- Sputtering / Additive processing
- PET Processing
Electronic Assembly
- Fully equiped Electronic assembly lab
- Thermocompression bonding (ACF/reflow)
- Micro welding (parallel gap/spot)
- Wire bonding (ball/wedge)
- Discrete component hand soldering
- Fluid dispensing (Potting/Dam and fill)
Mechanical Assembly
- Fully equiped Mechanical assembly lab
- Connector Assembly
- Flex Harness assembly
- Catheter assembly
- Micro machined EMI components