TECHNOLOGIES

HDI Flexible Circuits

• CAD/Cam DFM engineering
• Laser Direct Imaging
• Sub 25-Micron line and Spaces
• UV &Co2 Laser Drilling/Machining
• Advanced Material Processing
• Custom and RoHS Surface Finishes
• Plasma/Co2 Dielectric Removal
• Vacuum Assisted Lamination
• Precision CNC Machining/ CNC Punching
• Thin Film EMI Sheilding
• High Speed RF Microstrips and Striplines
• Sputtering / Additive processing
• PET Processing

Electronic Assembly

• Fully equiped Electronic assembly lab
• Thermocompression bonding (ACF/reflow)
• Micro welding (parallel gap/spot)
• Wire bonding (ball/wedge)
• Discrete component hand soldering
• Fluid dispensing (Potting/Dam and fill)

Mechanical Assembly

• Fully equiped Mechanical assembly lab
• Connector Assembly
• Flex Harness assembly
• Catheter assembly
• Micro machined EMI components