PANEL SIZE | | |
Panel Size | 12in x18in (304mmx457mm) | 12inx18in (304mmx457mm) |
Materials | | |
Plated Copper | 2um-70um Thick | 2um-70um Thick |
Polyimide | 12.5um-125um Thick | 12.5um-70um Thick |
Sheet Adhesives | Mod Acrylic, PSA, Mod Polyimide | Mod Acrylic, PSA, Mod Polyimide |
Coverlayer | | |
Film | 12um PI/12umADH-75umPI/75umADH | 12umPI/12umADH-75umPI/75um |
Photo imageable | 25um,37um,50um,62um | 25um,37um,50um,62um |
Stiffener | FR4, Polyimide, | FR4, Polyimide,Non-Ferrous metal |
Photo Imaging (LDI) | | |
Single and Double sided | | |
3-5µm Cu min (L/S) | 20µm-25µm | 10µm-20µm |
12µm Cu min (L/S) | 30µm-35µm | 20µm-25µm |
18µm Cu min (L/S) | 40µm-50µm | 30µm-45µm |
35µm Cu min (L/S) | 55µm-65µm | 40µm-55µm |
Layer to Layer Registration | <75um | <30um |
Smallest Feature | 20um | 10-15um |
DFSM | 25um,37um,50um,62um | 25um,37um,50um 62um |
Unsupported Flying Lead Width | 50um | 37um |
Multilayer Flex Imaging (LDI) | | |
Number of active layers | 1-3 layers | Up to 6 layers |
Layer to layer registration | <75 um | <30um |
Via Type | Through | Through / Blind/ Buried |
Microvias | | |
Size | 32um | 25um |
Positional Accuracy | 35um | 25um |
Layers | 1-3 Layers | Up to 6 layers |
Plating | | |
Electroless Copper | >32um Vias | >25um Vias |
Electrolytic Nickel | As required | As Required |
Electrolytic Copper | As Required | As Required |
Electrolytic Soft Gold | As Required | As Required |
Immersion Gold | 0.6um | 0.6 um |
ENIG | As Required | As Required |
Dielectric Patterning | | |
CO2 Laser | Yes | Yes |
Plasma Etch | Yes | Yes |
Chemical | Yes | Yes |
Sputtering | | |
Materials | Polyimide | Polyimide |
Metals | Various (Ti/Au/Cu/Cr) | Various (Ti/Au/Cu/Cr) |
Singulation | | |
Steel Ruled Die | 125um | 100um |
CNC Precision punch | | |
Positional Tolerance | 35um | 20um |
Smallest Feature | 150um | 100um |
Positional Tolerance | 37um | 25um |
Laser Profiling UV/CO² | 35um | 25um |
Quality | | |
Visual Inspection | Yes | Yes |
AOI | Yes | Yes |
Automated Repair Station | Yes | Yes |
Electrical Test (Flying Probe) | Yes | Yes |
XRF | Yes | Yes |
Automated Optical Measurement | Yes | Yes |
Ionic Contamination | Yes | Yes |
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