HIGH TECH FPCB’S & FPCB ASSEMBLY UNDER ONE ROOF!

PROCESS CAPABILITIES

DescriptionStandardAdvanced
PANEL SIZE
Panel Size12in x18in (304mmx457mm)12inx18in (304mmx457mm)
Materials
Plated Copper2um-70um Thick2um-70um Thick
Polyimide12.5um-125um Thick12.5um-70um Thick
Sheet AdhesivesMod Acrylic, PSA, Mod PolyimideMod Acrylic, PSA, Mod Polyimide
Coverlayer
Film12um PI/12umADH-75umPI/75umADH12umPI/12umADH-75umPI/75um
Photo imageable25um,37um,50um,62um25um,37um,50um,62um
StiffenerFR4, Polyimide,FR4, Polyimide,Non-Ferrous metal
Photo Imaging (LDI)
Single and Double sided
3-5µm Cu min (L/S)20µm-25µm10µm-20µm
12µm Cu min (L/S)30µm-35µm20µm-25µm
18µm Cu min (L/S)40µm-50µm30µm-45µm
35µm Cu min (L/S)55µm-65µm40µm-55µm
Layer to Layer Registration<75um<30um
Smallest Feature20um10-15um
DFSM25um,37um,50um,62um25um,37um,50um 62um
Unsupported Flying Lead Width50um37um
Multilayer Flex Imaging (LDI)
Number of active layers1-3 layersUp to 6 layers
Layer to layer registration<75 um<30um
Via Type Through Through / Blind/ Buried
Microvias
Size32um25um
Positional Accuracy35um25um
Layers1-3 LayersUp to 6 layers
Plating
Electroless Copper>32um Vias>25um Vias
Electrolytic NickelAs requiredAs Required
Electrolytic CopperAs RequiredAs Required
Electrolytic Soft GoldAs RequiredAs Required
Immersion Gold0.6um0.6 um
ENIGAs RequiredAs Required
Dielectric Patterning
CO2 LaserYesYes
Plasma EtchYesYes
ChemicalYesYes
Sputtering
MaterialsPolyimidePolyimide
MetalsVarious (Ti/Au/Cu/Cr)Various (Ti/Au/Cu/Cr)
Singulation
Steel Ruled Die125um100um
CNC Precision punch
Positional Tolerance35um20um
Smallest Feature150um100um
Positional Tolerance37um25um
Laser Profiling UV/CO²35um25um
Quality
Visual InspectionYesYes
AOIYesYes
Automated Repair StationYesYes
Electrical Test (Flying Probe)YesYes
XRFYesYes
Automated Optical MeasurementYesYes
Ionic ContaminationYesYes