PROCESS CAPABILITIES

Description

Standard

Advanced

PANEL SIZE

Panel Size

12in x18in (304mmx457mm)

12inx18in (304mmx457mm)

Materials

Plated Copper

2um-70um Thick

Polyimide

12.5um-125um Thick

12.5um-70um Thick

Sheet Adhesives

Mod Acrylic, PSA, Mod Polyimide

Coverlayer

Film

12um PI/12umADH-75umPI/75umADH

12umPI/12umADH-75umPI/75um

Photo imageable

25um,37um,50um,62um

Stiffener

FR4, Polyimide,

FR4, Polyimide,Non-Ferrous metal

Photo Imaging (LDI)

Single and Double sided

3-5µm Cu min (L/S)

20µm-25µm

10µm-20µm

12µm Cu min (L/S)

30µm-35µm

20µm-25µm

18µm Cu min (L/S)

40µm-50µm

30µm-45µm

35µm Cu min (L/S)

55µm-65µm

40µm-55µm

Layer to Layer Registration

<75um

<30um

Smallest Feature

20um

10-15um

DFSM

25um,37um,50um,62um

25um,37um,50um 62um

Unsupported Flying Lead Width

50um

37um

Multilayer Flex Imaging (LDI)

Number of active layers

1-3 layers

Up to 6 layers

Layer to layer registration

<75 um

<30um

Via Type

Through

Through / Blind/ Buried

Microvias

Size

32um

25um

Positional Accuracy

35um

25um

Layers

1-3 Layers

Up to 6 layers

Plating

Electroless Copper

>32um Vias

>25um Vias

Electrolytic Nickel

As required

As Required

Electrolytic Copper

As Required

Electrolytic Soft Gold

As Required

Immersion Gold

0.6um

0.6 um

ENIG

As Required

Dielectric Patterning

CO2 Laser

Yes

Plasma Etch

Yes

Chemical

Yes

Sputtering

Materials

Polyimide

Metals

Various (Ti/Au/Cu/Cr)

Singulation

Steel Ruled Die

125um

100um

CNC Precision punch

Positional Tolerance

35um

20um

Smallest Feature

150um

100um

Positional Tolerance

37um

25um

Laser Profiling UV/CO²

35um

25um

Quality

Visual Inspection

Yes

AOI

Yes

Automated Repair Station

Yes

Electrical Test (Flying Probe)

Yes

XRF

Yes

Automated Optical Measurement

Yes

Ionic Contamination

Yes

Depends on Design Constraints. Please contact Serflex engineering for more information